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Kuo: iPhone won't use RCC for thinner boards until 2025

By Julie Clover

The iPhone won't use polymer-coated copper (RCC) foil for its circuit boards until 2025, according to Apple analyst Ming-Chi Kuo. Kuo says Apple won't introduce the technology in 2024 due to its “fragile characteristics” and “inability to pass drop tests.”


If Apple and its supplier Ajinomoto can improve the RCC material before the third quarter of 2024, high-end iPhone 17 models will be able to use it. Resin-coated copper doesn't sound very impressive, but it can reduce the size of circuit boards, freeing up space inside the ‌iPhone‌ which can be used for larger batteries or other technologies. Kuo says it also simplifies the drilling process for ‌iPhone‌ production since RCC does not contain glass fiber.

Late last month, a circuit expert on Weibo said that Apple will adopt RCC for PCBs starting in 2024, but it looks like we won't see a change until 2025.

Tag: Ming-Chi Kuo [42 comments]

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